The CR-815SH ACF Bonding Machine is an advanced piece of equipment specifically designed for high-precision bonding of LCD panels, flexible printed circuits (FPC), chip-on-film (COF), and tape automated bonding (TAB) applications. Enabling manufacturers to combine different layers—like LCD panels and PCBs—efficiently, it offers remarkable versatility across a variety of display sizes, including 15" to 65" models. Leveraging modern advancements such as PID temperature control by Omron and a multi-speed pulse source design, this machine ensures outstanding results in terms of accuracy and efficiency. Built for high-volume production with a capacity of 0-100 units per day, it's suitable for both vertical and horizontal applications, making it a pivotal addition for any screen repair or LCD manufacturing operation. The CR-815SH is designed for easy setup and operation, featuring a single pneumatic device and customizable temperature rise curves, making it adaptable to various operational scenarios while maintaining a focus on quality.
Key Features
| Features | Description |
|---|---|
| Application | Suitable for bonding FPC, COF, TAB, LCD Panels and PCB. |
| Production Capacity | 0-100 units per day. |
| Bonding Mode | Pulse (Rapid Heating/Cooling and Auxiliary Cooling). |
| Temperature Control | PID temperature control for high precision. |
| Machine Size | 1240*840*1680 mm. |
| Net Weight | 430 kg. |
| Packaging Type | Wooden box (non-logs). |
| Display Capabilities | Supports 15"-65" LCD panel specifications. |
| Attributes | Description |
|---|---|
| Frequency | 50HZ |
| Camera PCB Side | Supports camera side for enhanced precision. |
| Stroke | 1 mm stroke for precise adjustments. |
| COF Counterpoint | Optical Path: Lens > Quartz > ITO Electrode > COF. |
| Additional Item Code | AN |
| Packing Dimensions | 1800X1200x1520 mm (L*W*H) |
| Number of Packages | 2 packages. |
*Disclaimer: The above description has been AI-generated and has not been audited or verified for accuracy. It is recommended to verify product details independently before making any purchasing decisions.
The CR-815SH ACF Bonding Machine features Pulse bonding mode with rapid heating, cooling, and auxiliary cooling.
This machine can accommodate LCD panels ranging from 15" to 65".
The machine uses PID temperature control by Omron, allowing high precision and adjustable temperature rise curves for optimal bonding.
The CR-815SH ACF Bonding Machine has a production capacity ranging from 0 to 100 units per day.
It is packaged in a wooden box made of glued board that requires no fumigation for exports.
Brand: weicai
Country Of Origin: India
Bonding Features:
COF Bonding Mode: Pulse (Rapid Heating/Cooling and Auxiliary Cooling).
PID Temperature Control: Omron PID system for precise temperature rise curve adjustments with high-precision auto-tuning.
Display Screen: Down counterpoint optical system: Lens > Quartz > ITO Electrode > COF.
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North West Delhi , India
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